PRIVATEConsole		Heating Handle
Power Consumption	20W( 2W at Powering Off )	Power Consumption	250W
Air Pump	Diaphragm Pump	Temperature Control Range	150 – 480 degrees C
Capacity	24L/min (Max.)
Overall Dimensions	187*135*245mm	size	196mm
Weight	Approx. 4kg	Weight	120g

 

Q-850D

Technical Features:

• Anti-electrostatic design to protect components and PCB from being damaged by static electricity or creepage;

• Closed loop and PID controlled sensor; precise and stable temperature measurement; Unsolder of temperature sensitive components such as BGA and CSP available;

• Intelligent cooling system; relay blowing after operation being done available; automatically powering off if air temperature is below 100 degrees C

• Hefty adjustment of air volume and temperature available; world class quality nozzle; Different nozzles for different chips while unsoldering;

• Nozzle can not contact elements while operating to avoid part's displacement and damages;

• Applicable to unsolder of SMT components, such as BGA, CSP, QFP, PLCC, SOIC; and used where temperature control and heating are required;

• Setup of time powering off available.

Specifications